Es 1061sp 2
2021年2月9日Download here: http://gg.gg/o8slx
ProductsPhysical PropertyFeatures & UsesSolid Content
(wt %)Specific Gravity
(20℃)Viscosity
(20℃)(cP)Chlorine Content
(%)Resing TypeGeneral UsePO-F-1010S150.8234.50.07Chip mounted & high density boards, standard type.PO-F-1010K170.8254.10.07Prevention of dew condensation.ES-1061SP-2150.8264.00.09Pb-free soldering.Lower ResiduePO-F-009M90.8073.20.06Chip mounted & high density boards, lower residue, spray coating.PO-F-710120.82030.06Chip mounted & high density boards, spray coating, lower residue.RMASR-209120.8203.7*RMALower residue, non-cleaning, lusterless type.SR-12120.8183.6*RMALower residue, non-cleaning. lustrous type.Water-Soluble TypeGeneral UseWF-2050200.8876.72.00High density electronic boards.Preliminary soldering of partsWF-3041461.1566.10.000Soldering of nickel & copper based alloys, halogen-free.Tinning FluxT-a10.8293.00.16Tinning for lead wire, negligible residues.Es-1061sp-2
ES-1061SP-2 ESR-250T4 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 Zero-cross time (sec.) 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 Temperature (oC) 240 250 260 240 250 260 Zero-cross time (sec.) Temperature (oC) SPARKLE FLUX ES SERIES ES series Sparkle Flux is a post-flux developed for the Lead-Free soldering of PC boards. Lead-Free solder has rather. Physical property Products Solid content Chlorine content Specic gravity （20） Remarks ES-1061SP-2 15% 0.09% 0.826 PreventsbridgingofES-1061, goodnishinthrough-hole ES-1077 7% 0.04% 0.804 Lowresidue ES-0307LS 15% 0.07% 0.826 LowAgcontent,Sn-Cualloy, goodwettability,goodlusterlessnsh. Properties of Post-Flux SPARKLE FLUX ES SERIES Products Physical property Solid content Chlorine content Specific gravity （20℃） Remarks Prevents bridging of ES-1061, good finish in through-hole ES-1061SP-2 ES-1077 ES-0307LS ES-0307LS-PD 15% 7% 15% 15% 0.09% 0.04% 0.07% 0.07% 0.826 0.804 0.826 0.826 Low residue Low Ag content, Sn-Cu alloy. Es-1061sp-2: es-1061ps-2 es-1061sp-2性能表: ソルダーペースト(クリーム半田) 開発元：(株)テリーサ研究所 製造元：小島半田製造所: mst-lf921p: mst-lf921p: ソルダーペースト(クリーム半田) (株)光輝: s3x48-a310d: s3x48-a310d: 棒半田: 千住金属工業(株) m705e: m705e合金: 糸半田: 千住.
* The procedure is similar to chlorides and bromides test.
There are many types of flux, depending on the required application and performance. Windows 7 iso. We supply a wide choice of fluxes including the resin type and water soluble type to meet every needs.ProductsPhysical PropertyFeatures & UsesSolid Content
(wt %)Specific Gravity
(20℃)Viscosity
(20℃)(cP)Chlorine Content
(%)Resing TypeGeneral UsePO-F-1010S150.8234.50.07Chip mounted & high density boards, standard type.PO-F-1010K170.8254.10.07Prevention of dew condensation.ES-1061SP-2150.8264.00.09Pb-free soldering.Lower ResiduePO-F-009M90.8073.20.06Chip mounted & high density boards, lower residue, spray coating.PO-F-710120.82030.06Chip mounted & high density boards, spray coating, lower residue.RMASR-209120.8203.7*RMALower residue, non-cleaning, lusterless type.SR-12120.8183.6*RMALower residue, non-cleaning. lustrous type.Water-Soluble TypeGeneral UseWF-2050200.8876.72.00High density electronic boards.Preliminary soldering of partsWF-3041461.1566.10.000Soldering of nickel & copper based alloys, halogen-free.Tinning FluxT-a10.8293.00.16Tinning for lead wire, negligible residues.Es 1061sp 220Es 1061sp 200
* The procedure is similar to chlorides and bromides test.
Sparkle Flux Es-1061sp-2
There are many types of flux, depending on the required application and performance. We supply a wide choice of fluxes including the resin type and water soluble type to meet every needs.
Download here: http://gg.gg/o8slx
https://diarynote.indered.space
ProductsPhysical PropertyFeatures & UsesSolid Content
(wt %)Specific Gravity
(20℃)Viscosity
(20℃)(cP)Chlorine Content
(%)Resing TypeGeneral UsePO-F-1010S150.8234.50.07Chip mounted & high density boards, standard type.PO-F-1010K170.8254.10.07Prevention of dew condensation.ES-1061SP-2150.8264.00.09Pb-free soldering.Lower ResiduePO-F-009M90.8073.20.06Chip mounted & high density boards, lower residue, spray coating.PO-F-710120.82030.06Chip mounted & high density boards, spray coating, lower residue.RMASR-209120.8203.7*RMALower residue, non-cleaning, lusterless type.SR-12120.8183.6*RMALower residue, non-cleaning. lustrous type.Water-Soluble TypeGeneral UseWF-2050200.8876.72.00High density electronic boards.Preliminary soldering of partsWF-3041461.1566.10.000Soldering of nickel & copper based alloys, halogen-free.Tinning FluxT-a10.8293.00.16Tinning for lead wire, negligible residues.Es-1061sp-2
ES-1061SP-2 ESR-250T4 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 Zero-cross time (sec.) 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 Temperature (oC) 240 250 260 240 250 260 Zero-cross time (sec.) Temperature (oC) SPARKLE FLUX ES SERIES ES series Sparkle Flux is a post-flux developed for the Lead-Free soldering of PC boards. Lead-Free solder has rather. Physical property Products Solid content Chlorine content Specic gravity （20） Remarks ES-1061SP-2 15% 0.09% 0.826 PreventsbridgingofES-1061, goodnishinthrough-hole ES-1077 7% 0.04% 0.804 Lowresidue ES-0307LS 15% 0.07% 0.826 LowAgcontent,Sn-Cualloy, goodwettability,goodlusterlessnsh. Properties of Post-Flux SPARKLE FLUX ES SERIES Products Physical property Solid content Chlorine content Specific gravity （20℃） Remarks Prevents bridging of ES-1061, good finish in through-hole ES-1061SP-2 ES-1077 ES-0307LS ES-0307LS-PD 15% 7% 15% 15% 0.09% 0.04% 0.07% 0.07% 0.826 0.804 0.826 0.826 Low residue Low Ag content, Sn-Cu alloy. Es-1061sp-2: es-1061ps-2 es-1061sp-2性能表: ソルダーペースト(クリーム半田) 開発元：(株)テリーサ研究所 製造元：小島半田製造所: mst-lf921p: mst-lf921p: ソルダーペースト(クリーム半田) (株)光輝: s3x48-a310d: s3x48-a310d: 棒半田: 千住金属工業(株) m705e: m705e合金: 糸半田: 千住.
* The procedure is similar to chlorides and bromides test.
There are many types of flux, depending on the required application and performance. Windows 7 iso. We supply a wide choice of fluxes including the resin type and water soluble type to meet every needs.ProductsPhysical PropertyFeatures & UsesSolid Content
(wt %)Specific Gravity
(20℃)Viscosity
(20℃)(cP)Chlorine Content
(%)Resing TypeGeneral UsePO-F-1010S150.8234.50.07Chip mounted & high density boards, standard type.PO-F-1010K170.8254.10.07Prevention of dew condensation.ES-1061SP-2150.8264.00.09Pb-free soldering.Lower ResiduePO-F-009M90.8073.20.06Chip mounted & high density boards, lower residue, spray coating.PO-F-710120.82030.06Chip mounted & high density boards, spray coating, lower residue.RMASR-209120.8203.7*RMALower residue, non-cleaning, lusterless type.SR-12120.8183.6*RMALower residue, non-cleaning. lustrous type.Water-Soluble TypeGeneral UseWF-2050200.8876.72.00High density electronic boards.Preliminary soldering of partsWF-3041461.1566.10.000Soldering of nickel & copper based alloys, halogen-free.Tinning FluxT-a10.8293.00.16Tinning for lead wire, negligible residues.Es 1061sp 220Es 1061sp 200
* The procedure is similar to chlorides and bromides test.
Sparkle Flux Es-1061sp-2
There are many types of flux, depending on the required application and performance. We supply a wide choice of fluxes including the resin type and water soluble type to meet every needs.
Download here: http://gg.gg/o8slx
https://diarynote.indered.space
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